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Cold Plate Cooling Systems: Design, Optimization, and Application in High Density Electronics

Thermal Interface Materials (TIMs): The Backbone of Efficient Thermal Management

Expert Thermal

Liquid Cooling for Data Centers: The Key to Unleashing AI and High-Density Computing

The Importance of Thermal Design and Analysis in Product Development: A Key to Success

Innovative Cooling Strategies for AI and HPC: Ensuring Efficiency and Sustainability 

The Rise of AI and the Need for Efficient Thermal Management

ShAPE-ing the Future: A New Technique for High-Performance Copper Composites

A High-Temperature Twist: Scientists Build the Foundation for Superconducting Switches of the Future